SKU: 32829527431
Ships within 48 hours · Estimated delivery Sep 6 - Sep 11
the innovative 3D thermal field mode is more intuitive
feel light
having brushless whirlpool motor
Machine Vision Lens for Vision Inspection/detection
HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Voltage:110V the innovative 3D thermal fieldHMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.
US$ 140.00
US$ 16.00
US$ 20.50
US$ 30.00
US$ 24.00
