MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items 1x 144 Led light

1x 144 Led light

5 Convex Cross/Phillips 1

Original Goot Wick Soldering Wick Accessory Braided Copper Wire Desoldering Wick BGA Solder Remover CP1515 CP2015 CP2515 CP3515

"Multiple" port charging

MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items 1x 144 Led lightMECHANIC Heat Mini Heating Station for Mobile Phone CPU IC Glue Removal. Intelligent one click heating, adjustable from 160C to 250C. Easily removes adhesive glue with a brush without damaging the chip. The 18*21mm heating area is compatible with most mobile phone chips, Nand Flash, CPUs, and other tasks involving adhesive and solder removal. Features: 1. Employs a professional temperature control curve algorithm with a built in factory calibrated