SKU: 18815273402
Ships within 48 hours · Estimated delivery Sep 4 - Sep 9
NET WEIGHT About: 550g
the beeping alarm will be turned on to prevent overheating damage to the motherboard
MJPEG /YUYV
The dot matrix module saves the original coordinates to the coordinate instrument before repairing
XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair Digital Multimeter NET WEIGHT About: 550gXZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8 A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. Features: Magnetic power positioning with strong magnetic force and automatic alignment. Built in powerful magnets with strong adsorption for easy pick up and fast maintenance. Easy to operate
US$ 74.95
US$ 19.95
US$ 119.95
