JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform JBC Qianli Fire Eye Ultra Thermal

Qianli Fire Eye Ultra Thermal imager can quickly diagnose and detect short circuits

Air volume is adjustable from 5% to 100%

Marking/engraving/removing the back cover

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JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform JBC Qianli Fire Eye Ultra ThermalJTXTOOLS T4MAX Glue Removal & Reballing Platform with 17 precision stencils for efficient glue removal and precise tin planting on CPU, EMMC, and RAM chips. Supporting 102 chip models across Apple iPhone, Android, Exynos, Qualcomm, HiSilicon, and Dimensity processors. A powerful magnetic force firmly secures the chip, automatically clamping and aligning it for precise chip placement. It is an essential tool for mobile phone repair technicians